Multi-feature-size electronic structures

ABSTRACT

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

FIELD OF THE INVENTION

[0001] The present invention relates generally to the field offabricating electronic devices with small functional elements depositingin various substrates and apparatuses comprising these electronicdevices.

BACKGROUND OF THE INVENTION

[0002] There are many examples of functional elements or componentswhich can provide, produce, or detect electromagnetic signals or othercharacteristics. An example of using the functional components is usingthem as an array of a display drivers in a display where many pixels orsub-pixels are formed with an array of electronic elements. For example,an active matrix liquid crystal display includes an array of many pixelsor sub-pixels which are fabricated using amorphous silicon orpolysilicon circuit elements. Additionally, a billboard display or ansignage display such as store displays and airport signs are also amongthe many electronic devices employing these functional components.

[0003] Functional components have also been used to make otherelectronic devices. One example of such use is that of a radio frequency(RF) identification tag (RF ID tag) which contains a chip or severalchips that are formed with a plurality of electronic elements.Information is recorded into these chips, which is then transferred to abase station. Typically, this is accomplished as the RF ID tag, inresponse to a coded RF signal received from the base station, functionsto cause the tag to reflect the incident RF carrier back to the basestation thereby transferring the information.

[0004] Demand for functional components has expanded dramatically.Clearly, the functional components have been applied to make manyelectronic devices, for instance, the making of microprocessors,memories, power transistors, super capacitors, displays, x-ray detectorpanels, solar cell arrays, memory arrays, long wavelength detectorarray, phased arrays of antennas, or the like. The growth for the use offunctional components, however, has been inhibited by the high cost ofassembling the functional components into other substrates.

[0005] For instance, functional components such as semiconductor chipshaving RF circuit, logic and memory have been incorporated into an RF IDtag. The tag also has an antenna, and a collection of other necessarycomponents such as capacitors or battery, all mounted on a substrate andsealed with another layer of material. Often the assembling of thesecomponents requires complex and multiple processes thereby causing theprice of the end product to be expensive. Further, the manufacturing ofthese RF ID tag is costly because of inefficient and wasteful use of thetechnologies and the materials used to make these products under thecurrent method.

[0006] Depositing semiconductor chips and other components ontosubstrates having the antenna is complex and tedious. The antennamaterial can be a thin film metal which can be deposited on substrates.Alternatively, the antenna material can also be adhered to thesubstrates using adhesive. These substrate are large compared to thesesemiconductor chip. The semiconductor chips to be interconnected to theantenna thus must be made large enough to allow for the interconnection.Because the semiconductor chips need to be large, material costs arethus high. Further, if there is a defective chip, the whole RF ID tagwould be defective and would not be discovered until the whole assemblyis complete. Then, the whole RF ID tag is disposed along with other goodcomponents. This is intrinsically wasteful and inefficient.

[0007] The functional components may also be incorporated intosubstrates to make displays such as flat panel displays, liquid crystaldisplays (LCDs), active matrix LCDs, and passive matrix LCDs. MakingLCDs has become increasingly difficult because it is challenging toproduce LCDs with high yields. Furthermore, the packaging of drivercircuits has become increasingly difficult as the resolution of the LCDincreases. The packaged driver elements are also relatively large andoccupy valuable space in a product, which results in larger and heavierproducts.

[0008] Furthermore, large displays such as those for signage purposesare expensive to make. Large displays are often made out of materialwith large-feature-size patterns that must be connected to integratedcircuits (ICs) with small feature sizes. the This results in expensivepackages that are bulky and expensive.

[0009] In general, these functional components include semiconductorsthat are manufactured on silicon wafers and then are packaged in thickchip carriers. These chip carriers, such as leaded chip packages, TapeAutomated Bonded (TAB) carrier or flip chip carriers are bulky andexpensive. Alternatively, integrated circuits incorporating intofunctional micro blocks can be used. These blocks and their functionalcomponents have been invented and disclosed in a copending U.S. patentapplication Ser. No. 09/251,220 which was filed Feb. 16, 1999 by theinventor John Stephen Smith and which is entitled “FunctionallySymmetric Integrated Circuit Die.” This application is herebyincorporated herein by reference.

SUMMARY OF THE INVENTION

[0010] The present invention provides methods and apparatuses for anelectronic assembly. According to one embodiment, the electronicassembly has a first object created and separated from a host substrate.The functional object has a first electrical circuitry therein. Acarrier substrate is coupled to the first object wherein the firstobject is being recessed below a surface of the carrier substrate. Thecarrier substrate further includes a first carrier connection pad and asecond carrier connection pad that interconnect with the first objectusing metal connectors. A receiving substrate, which is substantiallyplanar, including a second electrical circuitry, a first receivingconnection pad, and a second receiving connection pad that interconnectwith the second electrical circuitry using the metal connectors. Thecarrier substrate is coupled to the receiving substrate. This couplingis achieved through couplings of the first receiving connection pad tothe first carrier connection pad and the second receiving connection padto the second carrier connection pad. An electrical connection betweenthe first electrical circuitry and the second electrical circuitry isestablished.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1 illustrates an example of a functional component block.

[0012]FIG. 2 illustrates an exemplary embodiment of a carrier substratehaving the functional components blocks inserted therein.

[0013]FIG. 3 illustrates a planar view of an exemplary embodiment of anRF ID tag according to the present invention.

[0014]FIG. 4 illustrates a cross-sectional view of an exemplaryembodiment of an RF ID tag according to the present invention.

[0015]FIG. 4B illustrates a cross-sectional view of an exemplaryembodiment of an FR ID tag wherein the flexible strap has an additionalcover.

[0016] FIGS. 5-6 illustrate of an exemplary embodiment of an RF ID tagaccording to the present invention.

[0017] FIGS. 7A-B illustrate an exemplary embodiment of a signagedisplay having the IC included in the flexible strap.

[0018] FIGS. 8A-B illustrate an exemplary display of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

[0019]FIG. 1 illustrates an exemplary embodiment of an object that isfunctional component block 1. Block 1 has a top surface 2 upon which acircuit element is situated (not shown). The circuit element on the topsurface 2 may be an ordinary integrated circuit (IC) for any particularfunction. For example, the IC may be designed to drive a pixel of adisplay. The IC may also be designed to receive power from anothercircuit for the operation of a passive RF ID) tag. Alternatively, the ICmay be designed to receive power from an energy source (e.g. battery)for the operation of an active RF ID tag. In one embodiment, block 1 hasa trapezoidal cross-section where the top of the block is wider than thebottom of the block 1. Block 1 may be created from a host substrate andseparated from this substrate. This method of making block 1 can befound in the method described in copending U.S. patent application Ser.No. 09/251,220 referenced above.

[0020]FIG. 2 illustrates an exemplary embodiment in which block 1 isdeposited in a recessed region of a carrier substrate 12. Oncedeposited, the block 1 is recessed below a surface 32 of the carriersubstrate 12. The surface 32 of the carrier substrate 12 is the nativesurface of the substrate before any deposition of any other materials ontop of the surface 32. Carrier substrate 12 may be a flexible substratemade out of plastic, fabric, metal, or some other suitable materials. Ina preferred embodiment, carrier substrate 12 is flexible. FIG. 2 shows aplanar view of a web material of carrier substrate 12 having recessedregions or holes 21 therein. These recessed regions or holes 21 may becreated by a variety of methods. For example, the regions or holes 21may be created by a web wheel, roller, or template, that have protrudingstructures as described in U.S. patent application Ser. No. 09/270,165,entitled “Apparatuses and Methods for Forming Assemblies” (Docket No.003424.P016) by Jeffrey Jay Jacobsen. This patent application is herebyincorporated by reference. Another method involves using a templatehaving blocks wherein the blocks are pressed into web material makingrecessed regions or holes 21 into the web material of carrier substrate12. (See U.S. patent application Ser. No. 09/270,157, entitled “Methodsfor Transferring Elements From a Template to a Substrate” (Docket No.003424.P009) describing the donor transfer method).

[0021] The blocks 1 may be deposited into the recessed regions or holes21 of a carrier substrate 12 by a method described in U.S. Pat. No.5,545,291. The block 1 is then being recessed within the carriersubstrate 12 and below the surface 32 of the carrier substrate 12. TheU.S. Pat. No. 5,545,291 explained how to assemble microstructures onto asubstrate, and it is thus, incorporated herein by reference. Thisprocess may be referred to as FSA (fluidic self assembly) and may beperformed with a web material such as the web material for carriersubstrate 12. In one embodiment, a web material is advanced through aweb process apparatus. The FSA process deposits a plurality of blocksonto the web material wherein the blocks fall into recessed regionsfound in the web material.

[0022]FIG. 2 also shows a planar view of the web material of carriersubstrate 12 wherein the blocks 1 are seated in the recessed regions orholes 21. In one embodiment, electrical interconnect 30 is depositedonto the carrier substrate 12 interconnecting the top surface 2 of eachblock 1 to each other. Here, the web material of carrier substrate 12 isadvanced to a further point in the FSA process wherein an interconnectlayer is deposited thereon. The interconnect 30 may be comprised ofconductive polymers, metals (e.g., aluminum, copper, silver, gold,etc.), metal particles, conductive organic compounds, or conductiveoxides.

[0023] An insulation layer 31, which is a dielectric material, may becoated over the area that have the interconnect 30 to prevent shortcircuit with other functional components that the carrier substrate 12may come into contact with. The insulation layer 31 insulates thecircuit elements within the block 1 as well as the interconnect 30 thatconnects one block 1 to another block 1. The insulation layer 31 enablesthe carrier substrate 12 to cross over at least one electricalinterconnection (e.g., another interconnect 30 on another substrate, oran antenna loop) without shorting out the whole device.

[0024] The interconnect 30 may be flexible interconnect layers (notshown). These interconnect layers may be made with the techniques usedto create Tape Automated Bonding (TAB) tape interconnections wellpracticed in the semiconductor industry. The flexible interconnectlayers may be created from one of numerous types of materials which areappropriate for a web tape material which is designed to holdelectrically conductive interconnect layers. These materials includepolyimide tapes on which are deposited conductive traces of metal. Themetal may be deposited directly on the tape (e.g. by a blanketdeposition) and then patterned by etching, or a photoresist layer may beapplied and patterned, leaving grooves into which metal may bedeposited. The interconnect may be patterned to create an intricatewiring pattern such as row and/or column interconnects for an activematrix display backplane. The actual patterns will depend on theparticular application for these functional components. The flexibleinterconnect layer, once created, may be applied to the carriersubstrate 12.

[0025] It will be appreciated that the flexible interconnect layer maybe fabricated in a web process and then aligned with the web material ofcarrier substrate 12 having blocks 1 either in a web process or outsideof a web process. It will be further appreciated that the carriersubstrate may be flexible, planar, or rigid and made in a web process orbatch process. It will also be appreciated that an alignment operation,using conventional techniques, may be necessary to properly align theinterconnect layer 30 relative to the carrier substrate 12 with blockswhen the interconnect layer is coupled to the carrier substrate 12.

[0026] In one embodiment, the process of interconnecting the functionalcomponents (e.g., blocks 1) embedded in a substrate (e.g., carriersubstrate 12) uses only a single layer of metalization for interconnectlayer 30. This will reduce the possibility of interlayer shorts on theelectronic devices.

[0027]FIG. 3 illustrates an exemplary embodiment of an RF ID tag 300. Inthis embodiment, a flexible carrier strap 301 comprising functionalcomponents is coupled to a receiving substrate 310, also comprisingfunctional components. The flexible strap 301 may be the carriersubstrate 12 discussed in FIG. 2 above. The flexible strap 301 comprisesat least one functional component 302. The functional component 302 ismuch like the functional component block 1 of FIG. 1. The flexible strap301 also may comprise other necessary components 303 and 304 such as aresistor, a capacitor or an inductor for completing the necessarycircuitry. Components 303 and 304 may also be manufactured as blocks 1above. Components 302, 303 and 304 may be interconnected, typically,through metal connectors such as metal wires, thin evaporated layer ofconductor material (e.g., Aluminum) or ink containing metals (notshown). The interconnection of all the components can be achieved withthe interconnects 30 discussed above.

[0028] Flexible strap 301 further includes at least two carrierconnection pads 305 and 306. The carrier connection pads 305 and 306 areused to couple the flexible strap 301 to the receiving substrate 310(see below). The carrier connection pads 305 and 306 are made out ofconductive materials. A conductive adhesive can be used to couple theflexible strap 301 to the receiving substrate 310 thereby establishingelectrical interconnections for all of the functional components fromthe flexible strap 301 to those from the receiving substrate 310. Inanother embodiment, the methods called cold swaging or ultrasonicwelding which, are well practiced in the field, can be used to couplethe flexible strap 301 to the receiving substrate 310.

[0029] In one embodiment, the receiving substrate 310 includes anantenna 311 as a functional component. The receiving substrate 310 maybe flexible and made out of some low cost plastic or some other suitablematerial for the particular application. The receiving substrate 310 ispreferably planar. The antenna 311 may be loops of wire attached to thereceiving substrate 310. The antenna 311 may also be made out of screenprinted conductors such as silver, carbon, or metal that is coupled tothe receiving substrate 310 that has been etched with patterns toreceive the antenna material. The antenna 311 may also be made out oflaminated drawn foil that has an adhesive containing layer which enablesthe antenna to be coupled to the receiving substrate 310 in anyparticular pattern, for instance, loops. At each end of the loops of theantenna 311, there is a receiving connection pad, in this embodiment,receiving connection pads 312 and 313. The receiving connection pads 312and 313 are also made out of conductive materials to establish theconductive connection for all of the functional components from thereceiving substrate 310 to those from the flexible strap 301.

[0030] In order to complete the circuitry of the antenna 311, theflexible strap 301 is coupled to the receiving substrate 310. Thecoupling of the flexible strap 301 and the receiving substrate 310 isachieved through the attachment of the carrier connection pads 305 and306 to the receiving connection pads 312 and 313 as shown by arrows Aand B. The flexible strap 301 can cross over at least one conductingmaterial. Here, the flexible strap 301 crosses the loops of the antenna(FIG. 5). In one example, a conductive adhesive is used to couple all ofthe carrier connection pads to the receiving connection pads.

[0031] It will be appreciated that the flexible substrate 310 may haveother functional components or other circuitries, instead of or inaddition to the antenna 311. For instance, another functional componentlike blocks 1 which may have circuitries designed to drive display pixelelectrodes, to draw energy source, to sense external inputs, or totransfer data. In one embodiment, the total carrier connection pads(such as 305 and 306) is only two even if there are multiple functionalcomponents in the flexible strap 301.

[0032]FIG. 4A illustrates the cross-sectional view of the embodimentdescribed in FIG. 3. This figure, however, shows in details that thereis preferably an insulation layer 402 between the metal wires 401 thatinterconnect all of the components on the flexible strap 301 and theantenna 311 on the receiving substrate 310. The insulation layer 402 isa dielectric material that serves to electrically isolate the metalwires on flexible substrate 301 and the antenna 311 on the receivingsubstrate 310. Contacting the metal wires 401 with the antenna or theelectrical circuitry will short-circuit the antenna or other theelectrical circuitry.

[0033] In addition, the flexible strap 301 can be covered with aprotected layer 404 for extra protection (FIG. 4B). The protected layer404 can be made out of any flexible material such as polymer or plastic.The protected layer 404 can also be transparent or opaque.

[0034] The method of fabricating the electronic devices described inFIGS. 3, 4A and 4B can be applied to make a wide range of otherelectronic devices. The small flexible strap 301 with blocks 1 can bemade to be readily available components that can be used for anyparticular purpose. For example, the flexible strap 301 can be used inthe fabrication of display components, micro-electro-mechanicalstructural elements, or generally, an assembly of sensors or actuatorsor an assembly of circuit elements. Thus, devices such as flexibleantennas, other sensors, detectors, or an array of circuit elements maybe fabricated using one of the embodiments of the inventions.

[0035] Another advantage of the present invention is manufacturing ofelectronic devices that are having radically different feature sizes tointerface or integrate with one another. In order to lower the cost ofmaking electronic devices, blocks 1 are made with very small silicon orother materials suitable for carrying a circuit. Making blocks 1 small,(in the order of tens of micrometers in dimension) optimizes theexpensive technology and the expensive media materials necessary (e.g.,silicon wafer) to fabricate these blocks 1. (See U.S. patent applicationSer. No. 09/251,220 reference above). Making the blocks 1 small alsoenables the functional components to be small, thus, saving materialcost as well as the processing cost. Furthermore, small blocks 1 enablesmall packaging of the silicon material which means more of blocks 1 canbe produced at a higher rate with less materials.

[0036] However, integrating these functional micro blocks 1 into coarsematerials such as display components, antenna card, or other largeelectronic components, present problems of interfacing or integratingmaterials of radically different feature sizes. For instance, thesubstrate of a display is typically much bigger than that of the blocks1; or the substrate of an antenna in an RF ID tag is likewise muchbigger than that of the blocks 1. Integrating radically differentfeature size materials together is inherently wasteful of areal space,for instance, leaving die area typically useful for essential componentsunused. In yet another example, electronic components of high densitiessuch as transistors, when integrating with other large components, alsoneed to have high densities to minimize waste. Thus, when making largeelectronic devices, the functional components are often large. This iswasteful to expensive material.

[0037] In the present inventions, flexible strap 301 may be viewed as aninterposer which is an intermediate that bridge functional components ofradically different densities together without the waste of materials.With the present inventions, the functional component that is the mostexpensive to fabricate can be made like the blocks 1 which is very smallin dimension. The blocks 1 are then deposited into the flexible strap301, and then integrated with another functional components that can bemade out of a cheaper material or technology. More importantly, we canoptimize the most expensive technology, i.e., the interconnectingtechnology, where it is needed. Using the embodiments according to thepresent invention, the expensive interconnecting technology, (e.g., FSA)is only used in making the flexible strip 301 while the making of theantenna, for example, can be achieved using a lower cost interconnectingtechnology. The expensive processes and materials are thus optimized.

[0038] The following example illustrates the size differences for anelectrical device manufactured with the methods described above. Thefunctional block 14 has a total size of 350 μm×500 μm (width×length)with a design feature size or design rule of 0.5 μm. The flexible strap301 as a total size of 1.5 mm×10 mm with a design feature size of 20 μm.And, the receiving substrate 311 has the total size of 20 mm×50 mm withthe design feature size of 250 μm. The design feature size or designrule can be thought of as a density for each of the components. Theembodiments discussed therefore, enable the integrating and theinterfacing of radically different density electronic devices to eachother without wastes of expensive material and technology.

[0039]FIG. 5 illustrates an example of an RF ID tag 500 made using themethod described in FIGS. 3, 4A and 4B. Current art includes RF ID tags,which are small, nevertheless, contains very limited information due tothe size constraint. Also, current RF ID tags are inflexible because theIC packagings are rigid and large. Storing more information also meansthat the RF ID tag would have to have more functional components and asa result, require more interconnections among different functionalcomponents. Placing these many functional components on the samesubstrate is overly expensive and complex, not to mention increasing thechance for short circuit in the system. For a flexible and thin RF IDtag, it is desirable to have the silicon integrated circuitry (IC) besmall and thin. The blocks 1 described above may be used to contain theIC which can then be incorporated into the RF ID tag 500. The RF ID tag500 can be placed on products such as store merchandise as a way tolabel, identify, and track these products.

[0040] FIGS. 5 illustrates an example of depositing the all of thefunctional components except for the antenna 311 onto the flexible strap301 and using the flexible strap 301 to bridge the antenna 311. FIG. 6is an enlarged view of the flexible strap that is used in the RF ID tag500.

[0041] In a conventional method, the antenna 311 would be deposited onreceiving substrate 310, typically a thick material. The functionalcomponents (not shown) would then be deposited in area 500. Someconductive material would interconnect the functional components to eachother. Then, a strap would bridge one side of the loops of the antenna311 to the other side of the loops of. The strap has no function otherthan to complete the circuit for the antenna 311. Under the current artif there is a defective functional components, that will not be detecteduntil the whole fabrication of the RF ID tag 500 is completed. When thathappens, materials are wasted since the whole RF ID tag is discarded.Furthermore, the alignment of these functional components makes theassembly process complicated and expensive.

[0042] In the present embodiment, the functional components would beplaced in the flexible strap 301 and not area 500. The flexible strap301 would serve to bridge one side of the antenna 311 to the other sideof the antenna 311. Furthermore, the flexible strap 301 would carry thefunctional components that have particular functions, for instance, toreceive power for the operation of the RF ID tag 500 or to sendinformation to a base station of the RF ID tag base 500.

[0043] By using the embodiments of FIGS. 3-6 a low cost technology suchas screen-printing can be used to produce large area elements such asthe antenna 311. In one example, the antenna 311 may be printed inmassive quantity on some low cost substrate and using a process thatrequires less rigorous alignment. The functional component such as theblocks 1 to drive the antenna 311 or to send the data from the RF ID tag500, may be as described in U.S. patent application Ser. No. 09/251,220mentioned above. The blocks 1 are then integrated into the carriersubstrate 12 with a high precision and more expensive technology such asthe fluidic self-assembly. Thus, the small flexible strap 301 can beused to carry all of the essential components that are expensive tomanufacture. The expensive interconnecting technology is optimized inthat all of the essential components are packaged into the flexiblestrip 301 which is then coupled to the antenna that would be made out ofa lower cost interconnecting technology.

[0044] Another example using the flexible strap 301 to integrate withother functional components to make electrical device involves themaking of a signage display. FIGS. 7A-7B illustrate a general view of asignage display utilizing the flexible strap 301 of the presentinvention. The display system 700 includes a flexible strap 701, whichis similar to the flexible strap 301 described above, a top electrodelayer 710, a viewable area 720, and a backplane layer 730.

[0045] In a conventional technology, a general display system have itselectronic circuit elements, such as row or column driver circuits,attached to flexible circuits such as TAB tape. The assembly is thenattached to the LCD on one side and a PC board on the other. Anadditional set of circuits is usually added to the second glass orplastic layer. In a passive matrix LCD, the driver circuits are attachedto each glass or plastic substrate; in an active matrix LCD, the drivercircuits are attached to two or four edges on only one of the glass orplastic substrates. These drive circuits provide the electrical controlsignals and data required to form an image on the LCD. While an LCD isused for the example, the same principles apply to other display mediasuch as plasma, electroluminescence, electrophoretic, electrochromic,and the like.

[0046] Unlike the conventional method, in one embodiment of the presentinvention, the flexible strap 701 includes at least one integratedcircuit which is embedded in a functional block 702. The functionalblock 702 is manufactured as one of the blocks 1 discussed above. Thefunctional block 702 may be manufactured according to the methoddisclosed in the U.S. patent application Ser. No. 09/671,659, entitled“Display Devices and Integrated Circuits” which was filed on Sep. 27,2000, by inventors Roger Green Stewart, et. al., (Docket No.03424.P028). This patent application is incorporated by referenceherein.

[0047] In this embodiment, the functional block 702 is interconnected toeight output pads, 703 a, 703 b, 703 c, 703 d, 703 e, 703 f, 703 g, and703 h. Each of these output pads is responsible for driving a particularsegment of the display system. And, each of the segment displays aparticular image of the signage display. The functional block 702 mayalso include an output pad 705 for a ground signal, or other necessaryfunction for an integrated circuit.

[0048] Each of these output pads 703 a, 703 b, 703 c, 703 d, 703 e, 703f, 703 g, and 703 h functions like those carrier connection pads 305 and306. In essence, these pads establish electrical connections between theintegrated circuit included in the functional component 702 and thefunctional components on the display. In one example, the output pad 703g may be used to establish the electrical connection with the portion ofthe top electrode layer 710 that is responsible for controlling the“Jones Product” segment of the display system 700. Similarly, the outputpad 703 e may be used to establish the electrical connection with theportion of the top electrode layer 710 that is responsible forcontrolling the “Creations” segment of the display system 700. In otherwords, the output pads 703 a, 703 b, 703 c, 703 d, 703 e, 703 f, 703 g,and 703 h all establishes electrical connections with the top electrodelayer 710 that in turn drives the segments of the display system 700.

[0049] In a preferred embodiment, the flexible strap 701 is coupled tothe backplane layer 730 of the display system 700. To affix the flexiblestrap 701 to the display system 700, a thin layer of nonconductiveadhesive may be coated over the carrier substrate 704. In one example,the adhesive would be coated over the all of the area that do not havethe output pads 703 a, 703 b, 703 c, 703 d, 703 e, 703 f, 703 g, and 703h. Thus, the flexible strap 701 may be affixed to a surface such as thebackplane layer 730 while the electrical function of the output pads 703a, 703 b, 703 c, 703 d, 703 e, 703 f, 703 g, and 703 h would not beblocked by the adhesive layer. These outputs pads therefore, would beable to establish the necessary electrical connections with the topelectrode layer 710.

[0050] In another embodiment, the output pads 703 a, 703 b, 703 c, 703d, 703 e, 703 f, 703 g, and 703 h are all made out of conductiveadhesive such that when affixed to the top electrode layer 701, thesepads can establish both the mechanical as well as the electrical contactto the electrode layer 701.

[0051] It will be appreciated that the number of the output pads dependson the particular applications or the displays. The number of the outputpads may be more or less than eight output pads for each functionalcomponent block. Further, larger signage display can also be made usingthe examples discussed above. For instance, when the signage displayrequires more segments or portions for larger images, more functionalblocks 1 can be incorporated into the flexible strap 701.

[0052] In a preferred embodiment, the flexible straps 701 a, 701 b, 701c, and 701 d are coupled to the backplane layer 730 of the displaysystem 700-2. A thin layer of nonconductive adhesive may be coated overthe carrier substrate 704 a, 704 b, 704 c, and 704 d. The adhesive wouldbe coated over the all of the area that do not have the output pads.Thus, the flexible straps 701 a, 701 b, 701 c, and 701 d maybe affixedto the backplane layer 730 and the adhesive layer would not block theelectrical function of the associated output pads. These output padstherefore, would be able to establish the necessary electricalconnections with the top electrode layer 710 for the display 700.

[0053]FIG. 8A shows an overview of a display system 800, which can bethe signage display 700 in FIGS. 7A-7B. FIG. 8A illustrates a planarview of the display system 800 and FIG. 8B illustrates a cross-sectionalview of the display system 800. The display system 800 comprises of acarrier substrate 802, which includes integrated circuits, for example,block 1, for driving the display. In one embodiment, carrier substrate802 is flexible and small. For example, the carrier substrate 802 isconsiderably smaller than the receiving substrate 801. The carriersubstrate 802 is coupled to pixel electrodes 801A-801D on a receivingcarrier substrate 801 through the couplings of connection pads, forinstance connection pad 806A to 807A, connection pad 806B to 807B,connection pad 806C to 807C, and connection pad 806D to 807D. Thesecouplings would enable the integrated circuit to drive the pixelelectrodes 800A-800D in the display system 800. The display system 800also comprises insulation layer, display material, and counter electrodeor cover glass electrode. They are discussed in details below.

[0054]FIG. 8B shows a cross-sectional view of the display system 800according to one embodiment of the present invention. The display system800 includes a carrier substrate 802, which has receiving openings forfunctional components such as integrated circuits 802A, 802B, and 802C.The carrier substrate 802 is made using the embodiment discussed abovefor flexible strip 301 in FIG. 3. Similar to the embodiments discussedabove, the functional components once coupled to the carrier substrateare recessed within the carrier substrate and below the native surfaceof the carrier substrate. The carrier substrate 802 also includescarrier connection pads 806A-D, which establish mechanical as well aselectrical connections with the receiving substrate 801.

[0055] The receiving substrate 801 can be made using a coarse technologyand some coarse materials for making signage display. The display system800 includes a receiving substrate 801 which further comprising pixelelectrodes 801A-801D. The receiving substrate 801 also comprisesreceiving connection pads 807A-D. The receiving connection pads 807A-Dare interconnected with the pixel electrodes 801A-D and thus, whencoupled to the carrier connection pads 806A-D, establish mechanical aswell as electrical connections with the carrier substrate 802. Similarto the embodiments discussed above, the carrier substrate 802 can crossover at least one electrical interconnection on the receiving substrate801 without damaging or shorting the pixel electrodes on the receivingsubstrate 801. The carrier connection pads 806A-D are alsointerconnected with the ICs 802A, 802B and 802C. When all the necessaryconnections are established, the ICs will then drive the pixel electrodeof the signage display 800.

[0056] The integrated circuits 802A, 802B, and 802C are display driversin one embodiment. When proper mechanical and electrical connections areestablished, these integrated circuits will drive the pixel electrodesin the display system 800.

[0057] The carrier substrate 802 may be made out of a metal, foil, orflexible plastic material. An insulating layer 805 maybe attached to atop surface of the carrier substrate 802. In such an example, theinsulating layer 805 has a plurality of openings through whichelectrical interconnections can be established (e.g., vias through whichcarrier connection pads 806A-D interconnect with receiving connectionpads 807A-D).

[0058] A layer 808 may be provided on top of the pixels electrodes andthe conductive signals electrodes in order to insulate these parts fromthe display media material 803 which may be a nematic liquid crystal, anelectrophoretic display material, a polymer dispersed liquid crystalmaterial, an organic light emitting diode material, a cholesteric liquidcrystal material, an electrochromic material, a particle-based material,a thin-film electroluminescent material, or other known displaymaterials which can be driven by pixel electrodes or other types ofdisplay materials which may be controlled by electrodes. A counterelectrode or cover glass electrode 804 is typically a thin layer oftransparent indium tin oxide which is deposited upon a cover glass 900which is transparent. Spacers 809 are attached to the layer 808 and tothe cover glass 900 to provide a desired spacing between the counterelectrode 804 and the layer 808.

[0059] It can be seen from FIGS. 8A-8B that carrier substrate 802 actsas an interposer that integrates or interfaces two radically differentfeature sized electrical devices to each other (e.g., integrating themicro display drivers to the large signage display). The methodsdescribed above allow the ICs to be manufactured in the order ofsub-micrometer density. The methods above then enable the integration ofthe submicrometer ICs to a much coarser and larger display. Using thismethod, the ICs do not need to be made large in order to facilitate thecoupling of the ICs into a large display panel. Expensive materials andtechnologies are thus optimized. This provides for greatly reducedmanufacturing costs and improved yield and efficiency in themanufacturing process.

[0060] It will be appreciated that the display system 800 illustratesone exemplary embodiment of making display according the presentinvention. Displays according to the present invention may be used tofabricate displays with liquid crystals, polymer dispersed liquidcrystal, electroluminescent (EL) materials, organic light emittingdiodes (OLEDs), up and downconverting phosphor (U/DCP), electrophoretic(EP) materials, or light emitting diodes (LEDs).

[0061] Fabrication of display panels is well known in the art. Displaypanels may be comprised of active matrix or passive matrix. Activematrix panels and passive matrix panels may be either transmissive orreflective.

[0062] Liquid crystal displays (LCDs), for example, display system 800,can have an active-matrix backplane in which thin-film transistors areco-located with LCD pixels. Flat-panel displays employing LCDs generallyinclude five different components or layers. A light source, a firstpolarizing filter that is mounted on one side of a circuit panel onwhich the thin-film transistors are arrayed to form the pixels such aspixels 801A-801D. A filter plate containing at least three primarycolors are aligned with the pixels (for color displays), and a secondpolarizing filter. A volume between the circuit panel and the filterplate is filled with liquid crystal material, for instance, layer 803.This material will rotate the polarized light when an electric field isapplied between the thin-film transistor circuit panel and a electrodesaffixed to the filter plate or a cover glass. Thus, when a particularpixel of the display is turned on, the liquid crystal material rotatespolarized light being transmitted through the material so that it willpass through the second polarizing filter. Some liquid crystalmaterials, however, require no polarizers. LCDs may also have a passivematrix backplane which is usually two planes of strip electrodes whichsandwich the liquid crystal material. However, passive matricesgenerally provide a lower quality display compared to active matrices.U/DCP and EP displays are formed in similar fashion except the activemedium is different (e.g., upconverting gas, downconverting gas,electrophoretic materials).

[0063] EL displays have one or more pixels that are energized by analternating current (AC) that must be provided to each pixel by row andcolumn interconnects. EL displays generally provide a low brightnessoutput because passive circuitry for exciting pixel phosphors typicallyoperates at a pixel excitation frequency that is low relative to theluminance decay time of the phosphor material. However, an active matrixreduces the interconnect capacitance allowing the use of high frequencyAC in order to obtain more efficient electroluminescence in the pixelphosphor. This results in increased brightness in the display.

[0064] LED displays are also used in flat-panel displays. LEDs emitlight when energized. OLEDs operate like the LEDs except OLEDs useorganic material in the formation of the light emitting device.

[0065] The displays discussed above are particularly useful for signagedisplays used in airport terminal, commercial signage display, orbillboard displays. These types of displays are typically large and themanufacturing of the display panel is relatively cheap due to the factthat they employ a less rigorous technology with large feature sizes.However, the integrated circuit needed to drive these types of displaysare expensive to make and have small feature sizes. The method of thisinvention allows the manufacturers to make the IC very small and stillconnect them to the large signage display.

[0066] The flexible strap 301 is particularly crucial for integratingand interfacing electronic devices of radically different feature sizes.Integrating and interfacing the blocks 1 to a coarse and large displayrequires the blocks 1 to be large enough in order for the integratingand the interfacing to be feasible. However, to minimize cost in makingthe IC, the blocks 1 are very small in feature size, for example, theblocks 1 have a densities in the vicinity of sub-micrometer. The signagedisplay is typically in the order of 100-250 micrometer in density. Oneway to efficiently integrating and interfacing the signage display tothe blocks 1 is through using the carrier substrate discussed above forthe flexible strap 301.

[0067] The following example illustrates the size differences for asignage display manufactured with the methods described above. Thefunctional block 1 has a total size of 350 μm×500 μm (width×length) witha design feature or design rule of 0.5 μm. The carrier substrate 802 hasa total size of 10 mm×10 mm with a design feature of 20 μm. And, thereceiving substrate 801 has the total size of 20 in×50 n with the designfeature of 250 μm. The carrier substrate is thus about one order ofmagnitude different from the functional block 1 and an order ofmagnitude different from the signage display. The embodiments discussedtherefore, enable the integrating and the interfacing of electronicdevices having radically different density, feature size, and totalsize, to each other without wastes of expensive material and technology.

[0068] An electrical device made according to the embodiments of thepresent invention also has an advantage of being multi-feature-size. Forinstance, the carrier substrate 12 may have a feature size (design rule)that is at least five times larger than the block 1. The carriersubstrate 12 also has a feature size that is at least five times smallerthan the receiving substrate 310.

[0069] The functional block 1 can be packaged in a flexible strap, thecarrier substrate discussed above. Flexible packaging also means thatthese signage displays can be made flexible which is extremely usefulfor many purposes. It also means that the sign can be very thin, owingto the thin dimension of the flexible strap.

[0070] An electrical device made according to the embodiments of thepresent invention also has all of the electrical circuitry in thefunctional components and the necessary interconnections, (e.g., thefirst interconnection and the second interconnection) are allessentially in coplanar to each other. As can be seen from FIG. 3 andFIG. 5, when the whole device is assembled together, all of thecomponents mentioned above are essentially in one plane field.Alternatively, all of the electrical circuitry in the functionalcomponents and the necessary interconnection, (e.g., the firstinterconnection and the second interconnection) each forms a plane thatis separated from one another by less than ten micrometers. Thereforethe planar electrical circuitry on the functional component, the planarfirst interconnection on the carrier substrate, and the planer secondinterconnection on the receiving substrate are all coplanar with eachother such that their planes are typically separated by less than 10micrometers.

We claim:
 1. An electronic assembly comprising: a first object createdand separated from a host substrate, said first object having a firstelectrical circuitry therein; a carrier substrate coupling to said firstobject, said carrier substrate further comprising a first carrierconnection pad and a second carrier connection pad that interconnectwith said first object using metal connectors, said first object furtherbeing recessed below a surface of said carrier substrate; and areceiving substrate including a second electrical circuitry which issubstantially planar, said receiving substrate further including a firstreceiving connection pad, and a second receiving connection pad thatinterconnect with said second electrical circuitry using said metalconnectors, said first receiving connection pad couples to said firstcarrier connection pad and said second receiving connection pad couplesto said second carrier connection pad providing an electrical connectionbetween said first electrical circuitry and said second electricalcircuitry.
 2. An electronic assembly as in claim 1 further comprising aninsulation layer, said insulation layer insulating said first electroniccircuitry and said second electronic circuitry.
 3. An electronicassembly as in claim 2 wherein said second electrical circuitry is anantenna.
 4. An electronic assembly as in claim 3 wherein said carriersubstrate is a flexible strap and wherein said first object comprises aradio frequency circuitry for use in a radio frequency identificationtag.
 5. An electronic assembly as in claim 1 wherein said carriersubstrate is flexible.
 6. An electronic assembly as in claim 1 whereinsaid first object is an integrated circuitry.
 7. An electronic assemblyas in claim I further comprising at least one second object, said secondobject being recessed within said carrier substrate and beinginterconnected to said first to said first object using said metalconnectors.
 8. An electronic assembly as in claim 7 further comprisingat least one third object, said third object being coupled to saidreceiving substrate and being interconnected to said second electricalcircuitry using said metal connectors.
 9. An electronic assembly as inclaim 1 wherein said second electrical circuitry is a printed circuitboard.
 10. An electronic assembly as in claim 1 wherein said electronicassembly is a multi-feature-size structure in which said carriersubstrate is at least five times larger in feature size than said firstobject and wherein said carrier substrate is at least five times smallerin feature size than said receiving substrate.
 11. An electronicassembly as in claim 5 wherein said electronic assembly is amulti-feature-size structure in which said carrier substrate is at leastfive times larger in feature size than said first object and whereinsaid carrier substrate is at least five times smaller in feature sizethan said receiving substrate.
 12. An electronic assembly as in claim 11wherein said carrier substrate couples to said first object through afluidic self-assembly process.
 13. An electronic assembly as in claim 1wherein said carrier substrate couples to said first object through afluidic self-assembly process.
 14. An electronic assembly as in claim 1wherein said first carrier connection pad and said second carrierconnection pad are the only carrier connection pads on said carriersubstrate.
 15. An electronic assembly as in claim 12 wherein aconductive adhesive material is used to couple said first carrierconnection pad to said first receiving connection pad and said secondcarrier connection pad to said second receiving connection pad.
 16. Anelectronic assembly comprising: a first object created and separatedfrom a host substrate, said first object having a first electricalcircuitry therein; a carrier substrate coupling to said first object,said carrier substrate further comprising a first carrier connection padand a second carrier connection pad that interconnect with said firstobject using metal conductors; a receiving substrate including a secondelectrical circuitry which is substantially planar, said receivingsubstrate further including a first receiving connection pad, and asecond receiving connection pad which interconnect with said secondelectrical circuitry using said metal conductors, said first receivingconnection pad couples to said first carrier connection pad and saidsecond receiving connection pad couples to said second carrierconnection pad providing an electrical connection between said firstelectrical circuitry and said second electrical circuitry; and saidcarrier substrate crosses over at least one of said metal conductors onsaid receiving substrate and is at least five times larger in featuresize than said first object and at least five times smaller in featuresize than said receiving substrate.
 17. An electronic assembly as inclaim 16 wherein said electronic assembly is a multi-feature-sizestructure in which said carrier substrate is at least ten times largerthan said first object and wherein said carrier substrate is at leastten times smaller than said receiving substrate.
 18. An electronicassembly as in claim 17 wherein said carrier substrate couples to saidfirst object through a fluidic self-assembly process.
 19. An electronicassembly as in claim 18 wherein said carrier substrate is flexible. 20.An electronic assembly comprising: a first object created and separatedfrom a host substrate, said first object having a first electricalcircuitry therein; a carrier substrate coupling to said first object,said carrier substrate further comprising a first carrier connection padand a second carrier connection pad that forms a first interconnectionwith said first object using metal conductors; a receiving substrateincluding a second electrical circuitry which is substantially planar,said receiving substrate further including a first receiving connectionpad, and a second receiving connection pad that forms a secondinterconnection with said second electrical circuitry using said metalconductors, said first receiving connection pad couples to said firstcarrier connection pad and said second receiving connection pad couplesto said second carrier connection pad providing an electrical connectionbetween said first electrical circuitry and said second electricalcircuitry; and said first electrical circuitry, said firstinterconnection, and said second interconnection are essentiallycoplanar.
 21. An electronic assembly as in claim 20 wherein each of saidfirst electrical circuitry, said first interconnection, and said secondinterconnection forms a plane and each of said plane is separated fromone another by less than ten micrometers.
 22. An electronic assembly asin claim 21 wherein said carrier substrate is flexible.
 23. A method ofmaking an electronic assembly comprising: creating and separating afirst object from a host substrate, said first object having a firstelectrical circuitry therein; coupling a carrier substrate to said firstobject, said carrier substrate further comprising a first carrierconnection pad and a second carrier connection pad that interconnectwith said first object using metal conductors, said first object furtherbeing recessed below a surface of said carrier substrate; andintegrating said carrier substrate to a receiving substrate including asecond electrical circuitry which is substantially planar and includinga first receiving connection pad, and a second receiving connection padthat interconnect with said second electrical circuitry using said metalconductors, said integrating providing an electrical connection betweensaid first electrical circuitry and said second electrical circuitrywherein said first receiving connection pad couples to said firstcarrier connection pad and said second receiving connection pad couplesto said second carrier connection pad.
 24. A method of making anelectronic assembly as in claim 23 further comprising coating aninsulation layer over said metal conductors, said insulation layer toinsulate said first electronic circuitry and said second electroniccircuitry.
 25. A method of making an electronic assembly as in claim 24further comprising configuring said second electrical circuitry to be anantenna.
 26. A method of making an electronic assembly as in claim 25further comprising configuring said carrier substrate to be a flexiblestrap wherein said first object comprises a radio frequency circuitryfor use in a radio frequency identification tag.
 27. A method of makingan electronic assembly as in claim 23 further comprising configuringsaid first object to be an integrated circuitry.
 28. A method of makingan electronic assembly as in claim 23 further comprising configuringsaid second electrical circuitry to be a printed circuit board.
 29. Amethod of making an electronic assembly as in claim 23 furthercomprising making said electronic assembly a multi-feature-sizestructure wherein said carrier substrate is at least five times largerin feature size than said first object and said carrier substrate is atleast five times smaller in feature size than said receiving substrate.30. A method of making an electronic assembly as in claim 23 whereinsaid coupling of said carrier substrate to said first functional objectis accomplished through a fluidic self-assembly process.
 31. A method ofmaking an electronic assembly comprising: creating and separating afirst object from a host substrate, said first object having a firstelectrical circuitry therein; coupling a carrier substrate to said firstobject, said carrier substrate further comprising a first carrierconnection pad and a second carrier connection pad that interconnectwith said first object using metal conductors; integrating said carriersubstrate to a receiving substrate including a second electricalcircuitry which is substantially planar and including a first receivingconnection pad, and a second receiving connection pad that interconnectwith said second electrical circuitry using said metal conductors, saidintegrating providing an electrical connection between said firstelectrical circuitry and said second electrical circuitry wherein saidfirst receiving connection pad couples to said first carrier connectionpad and said second receiving connection pad couples to said secondcarrier connection pad; crossing said carrier substrate over at leastone of said metal conductors on said receiving substrate; andconfiguring said carrier substrate to be at least five times larger infeature size than said first object and at least five times smaller infeature size than said receiving substrate.
 32. A method of making anelectronic assembly comprising: creating and separating a first objectfrom a host substrate, said first object having a first electricalcircuitry therein; coupling a carrier substrate to said first object,said carrier further comprising a first carrier connection pad and asecond carrier connection pad that forms a first interconnection withsaid first object using metal conductors; integrating said carriersubstrate to a receiving substrate including a second electricalcircuitry which is substantially planar, said receiving substratefurther including a first receiving connection pad, and a secondreceiving connection pad that forms a second interconnection with saidsecond electrical circuitry using said metal conductors, saidintegrating providing an electrical connection between said firstelectrical circuitry and said second electrical circuitry wherein saidfirst receiving connection pad couples to said first carrier connectionpad and said second receiving connection pad couples to said secondcarrier connection pad; and configuring said first object, said carriersubstrate, said receiving substrate, said first interconnection, saidsecond interconnection, and said electrical interconnection to beessentially coplanar.
 33. An electronic assembly comprising: a firstobject created and separated from a host, said first object having afirst electrical circuitry therein; a carrier substrate coupling to saidfirst object through a fluidic self-assembly process, said carriersubstrate further comprising a first carrier connection pad and a secondcarrier connection pad that interconnect with said first object usingmetal connectors, said first object further being recessed below asurface of said carrier substrate; and a receiving substrate including asecond electrical circuitry which is substantially planar, saidreceiving substrate further including a first receiving connection pad,and a second receiving connection pad that interconnect with said secondelectrical circuitry using said metal connectors, said first receivingconnection pad couples to said first carrier connection pad and saidsecond receiving connection pad couples to said second carrierconnection pad providing an electrical connection between said firstelectrical circuitry and said second electrical circuitry.
 34. Anelectronic assembly as in claim 33 wherein said carrier substrate isflexible.
 35. A method of making an electronic assembly comprising:creating and separating a first object from a host substrate, said firstobject having a first electrical circuitry therein; using a fluidicself-assembly process to couple a carrier substrate to said firstobject, said carrier substrate further comprising a first carrierconnection pad and a second carrier connection pad that interconnectwith said first object using metal conductors, said first object furtherbeing recessed below a surface of said carrier substrate; andintegrating said carrier substrate to a receiving substrate including asecond electrical circuitry which is substantially planar and includinga first receiving connection pad, and a second receiving connection padthat interconnect with said second electrical circuitry using said metalconductors, said integrating providing an electrical connection betweensaid first electrical circuitry and said second electrical circuitrywherein said first receiving connection pad couples to said firstcarrier connection pad and said second receiving connection pad couplesto said second carrier connection pad.
 36. A display device comprising:an array of display drivers, each of said display drivers is formed in ahost substrate and then removed from said host substrate and thendeposited onto a carrier substrate such that each of said displaydrivers is recessed below a surface of said carrier substrate; saidcarrier substrate further including a plurality of carrier connectionpads, said plurality of carrier connection pads interconnecting withsaid array of display drivers and coupling to a receiving substrate;said receiving substrate including an array of pixel electrodesinterconnecting to a plurality of receiving connection pads wherein saidplurality of receiving connection pads couples to said plurality ofcarrier connection pads providing necessary electrical connectionsbetween said array of display drivers and said array of pixelelectrodes; and said array of display drivers control said displaydevice.
 37. A display device as in claim 36 wherein said display driversdrive pixel electrodes which control a display medium which comprisesone of a liquid crystal material, an electrophoretic material, anorganic light emitting diode material, a semiconductor light emittingdiode material, particle-based material, thin film electroluminescentmaterial, and electrochromic material.
 38. A display device as in claim36 wherein said display device is a multi-feature-size structure inwhich said carrier substrate is at least five times larger in featuresize than each of said display drivers and wherein said carriersubstrate is at least five times smaller in feature size than saidreceiving substrate.
 39. A display device as in claim 36 wherein saidcarrier substrate is at least ten times larger than said display driversand said carrier substrate is at least ten times smaller than saidreceiving substrate.
 40. A display device as in claim 36 wherein saidplurality of carrier connection pads and said plurality of receivingconnection pads are interconnected by conductive adhesives.
 41. Adisplay device as in claim 36 wherein each of said driver displays areintegrated circuits designed to drive said array of pixel electrodes.42. A display device as in claim 36 wherein said carrier substratecrosses over at least one electrical connection on said receivingsubstrate.
 43. A display device as in claim 36 wherein each of saiddisplay drivers is deposited onto said carrier substrate through afluidic self-assembly process.
 44. A display device as in claim 36wherein said carrier substrate is flexible.
 45. A method of making adisplay device comprising: forming an array of display drivers, each ofsaid display drivers being formed in a host substrate; removing saidarray of display drivers from said host substrate; depositing said arrayof display drivers onto a carrier substrate such that each of saiddisplay drivers is recessed below a surface of said carrier substrate,said carrier substrate further including a plurality of carrierconnection pads which interconnect with said array of display drivers;integrating said display drivers to said array of display driver to areceiving substrate which includes an array of pixel electrodes and aplurality of receiving connection pads which interconnect with saidarray of pixel electrodes, said integrating providing necessaryelectrical connections between said array of display drivers and saidarray of pixel electrodes and occurring when said plurality of carrierconnection pads couples to said plurality of receiving connection pads;and designing said array of display drivers to control said displaydevice.
 46. A method of making a display device as in claim 45 furthercomprising configuring said display drivers to drive pixel electrodeswhich control a display medium which comprises one of a liquid crystalmaterial, an electrophoretic material, an organic light emitting diodematerial, a semiconductor light emitting diode material, particle-basedmaterial, thin film electroluminescent material, and electrochromicmaterial.
 47. A method of making a display device as in claim 45 furthercomprising configuring said display device to be a multi-feature-sizestructure in which said carrier substrate is at least five times largerin feature size than each of said display drivers and wherein saidcarrier substrate is at least five times smaller in feature size thansaid receiving substrate.
 48. A method of making a display as in claim45 further comprising configuring said carrier substrate to be at leastten times larger than said display drivers and said carrier substrate tobe at least ten times smaller than said receiving substrate.
 49. Amethod of making a display device as in claim 45 comprising insulatingsaid arrays of pixel electrodes from said display medium with aninsulation layer.
 50. A method of making a display as in claim 45wherein a fluidic self-assembly process is used to couple each of saidarray of display drivers onto said carrier substrate.
 51. A method ofmaking a display device as in claim 45 further comprising configuringsaid carrier substrate to be flexible.